at Integra Technologies in Wichita, Kansas, United States
Job Description
POSITION SUMMARY
Perform a variety of non-destructive and destructive processes in order to determine the integrity and quality of electronic components. These processes range from visual inspection and physical measurement of electronic components, performing real time X-Ray and Acoustic Microscopy of electronic components to performing mechanical and chemical de-encapsulation, internal visual inspection and wire bond pull utilizing various tools such as, XRF, scanning acoustic microscope (SEM), hermeticity test equipment and optical microscopes.
KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE
- Follow Quality Documentation Manual procedures to correctly evaluate components.
- Confer with DPA, engineers, technicians, and operations regarding test results.
- Verify component counts, examine lead integrity, and follow strict processing instructions to properly complete analysis steps.
- Read and interpret a wide variety of technical instructions and specifications.
- Work with OMS (Order Management System) to log in to assigned work, read and verify instructions, and submit completed results.
- Visually inspect electronic components.
- Take measurements of electronic components.
- Perform mechanical, Laser and chemical de-encapsulation.
- Perform internal visual inspection and wire bond pull to operating various tools such as real time X-ray, XRF, scanning acoustic microscope, hermeticity test equipment and optical microscopes.
- Flexibility to perform other duties as assigned.
